EPOXY RESIN COMPOSITION FOR SEALING AND ELECTRONIC DEVICE

Title:

EPOXY RESIN COMPOSITION FOR SEALING AND ELECTRONIC DEVICE

Document Type and Number:

WIPO Patent Application WO/2023/182370

Kind Code:

A1

Abstract:

Provided are an electronic device and an epoxy resin composition for sealing having high storage stability and for which the curing rate can be enhanced during curing. This epoxy resin composition for sealing contains an epoxy resin (A), a curing agent (B), a curing accelerator (C), and an inorganic filler (D). The curing accelerator (C) contains an amidine silicate (C1) represented by formula (1).

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Inventors:

MAEDA YASUAKI
OGAWA KAZUTO
FUJIWARA HIROYUKI

Application Number:

PCT/JP2023/011275

Publication Date:

September 28, 2023

Filing Date:

March 22, 2023

Export Citation:

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Assignee:

PANASONIC IP MAN CO LTD (JP)

International Classes:

C08G59/56; H01L23/29; H01L23/31

Domestic Patent References:

WO2020054356A1	2020-03-19
WO2017195822A1	2017-11-16

Foreign References:

JP2018104559A	2018-07-05
JP2018203916A	2018-12-27
JP2014070035A	2014-04-21

Attorney, Agent or Firm:

HOKUTO PATENT ATTORNEYS OFFICE (JP)

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