Title:
EPOXY RESIN CURING ACCELERATOR
Document Type and Number:
WIPO Patent Application WO/2016/120925
Kind Code:
A1
Abstract:
Provided is an epoxy resin curing accelerator which exhibits excellent fluidity when filled into a mold, while having high catalytic activity and excellent curability. The present invention is an epoxy resin curing accelerator (Q) which is characterized by containing: a phosphonium salt (S) that is composed of a quaternary phosphonium (A) represented by general formula (1) and an anion of an organic carboxylic acid (B) represented by general formula (2); and an organic phenolic compound (C) represented by general formula (3).
(In formula (1), each of R1-R3 represents an aryl group having 6-12 carbon atoms; and R4 represents an alkyl group having 1-8 carbon atoms or an aryl group having 6-12 carbon atoms. In formula (2), R5-R7 may be the same or different, and each represents a hydroxyl group, a carboxyl group, a hydrogen atom or an alkyl group having 1-4 carbon atoms; and R8 represents a hydroxyl group or a carboxyl group. In formula (3), R9-R11 may be the same or different, and each represents a hydroxyl group, a carboxyl group, a hydrogen atom or an alkyl group having 1-4 carbon atoms.)
Inventors:
CHEN LIYI (JP)
SHIBAGAKI TOMOYUKI (JP)
SHIBAGAKI TOMOYUKI (JP)
Application Number:
PCT/JP2015/005833
Publication Date:
August 04, 2016
Filing Date:
November 24, 2015
Export Citation:
Assignee:
SAN APRO LTD (JP)
International Classes:
C08G59/68; C07C39/08; C07C39/10; C07C57/34; C07C59/52; C07F9/54
Foreign References:
| JP2002179768A | 2002-06-26 | |||
| JP2003286335A | 2003-10-10 | |||
| JP2003292582A | 2003-10-15 | |||
| JPH0320065A | 1991-01-29 |
Attorney, Agent or Firm:
HAYASHI, HIROSHI (JP)
Wood Hiroshi (JP)
Wood Hiroshi (JP)
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