EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, AND ADHESIVE AGENT FOR LAMINATE

Title:

EPOXY RESIN CURING AGENT, EPOXY RESIN COMPOSITION, AND ADHESIVE AGENT FOR LAMINATE

Document Type and Number:

WIPO Patent Application WO/2011/132637

Kind Code:

A1

Abstract:

Disclosed are: an epoxy resin curing agent that, in addition to high gas barrier performance and the excellent performance that epoxy resins have, imparts favorable adhesiveness with respect to polyesters and aluminum; an epoxy resin composition containing same; an adhesive agent that is for a laminate and that has said composition as the primary component; a laminate film using said adhesive agent; a multilayered packaging material; and a bag for packaging. The epoxy resin curing agent is characterized by being the reaction product of the belowmentioned A, B, and C: (A) a metaxylylene diamine or a paraxylylene diamine; (B) a polyfunctional compound that has one acyl group, forms an amide group site by means of a reaction with a polyamine, and can form an oligomer; and (C) a metal (meth)acrylate formed from a metal having a valency of at least two.

Inventors:

MATSUMOTO NOBUHIKO (JP)
HONDA EIICHI (JP)
KUMAMOTO KANA (JP)

Application Number:

PCT/JP2011/059524

Publication Date:

October 27, 2011

Filing Date:

April 18, 2011

Export Citation:

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Assignee:

MITSUBISHI GAS CHEMICAL CO (JP)
MATSUMOTO NOBUHIKO (JP)
HONDA EIICHI (JP)
KUMAMOTO KANA (JP)

International Classes:

C08G59/40; C09J11/06; C09J163/00; C09J163/02

Domestic Patent References:

WO1999060068A1

1999-11-25

Foreign References:

JP2004027014A	2004-01-29
JP2003251775A	2003-09-09
JP2002256208A	2002-09-11
JPH05140555A	1993-06-08
JP2009167335A	2009-07-30
JPH0641422A	1994-02-15
JPH0551574A	1993-03-02
JPH09316422A	1997-12-09
JP2000154365A	2000-06-06
JP2002256208A	2002-09-11

Other References: