Title:
EPOXY RESIN, METHOD FOR PRODUCING THE EPOXY RESIN, EPOXY RESIN COMPOSITION USING THE EPOXY RESIN, AND CURED PRODUCT OF THE EPOXY RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/047613
Kind Code:
A1
Abstract:
Disclosed is an epoxy resin which is obtained by epoxidizing a phenol resin represented
by the formula (1) below and having a hydroxyl equivalent of 160-230 g/eq.
(1) (In the formula, P, R and m are independent from one another, and
P represents an alkyl group having 1-6 carbon atoms, R represents a hydrogen or
an alkyl group having 1-6 carbon atoms, and m represents an integer of 0-3. In
this connection, n represents the number of repetitions.) The epoxy resin is
capable of providing a cured product which is excellent in low water absorption,
low dielectric property, flame retardance and heat resistance. Also disclosed
are an epoxy resin composition containing the epoxy resin and a curing agent and
a cured product obtained by curing the epoxy resin composition.
Inventors:
KAWAI KOICHI (JP)
OSHIMI KATSUHIKO (JP)
SUNAGA TAKAO (JP)
NAKANISHI MASATAKA (JP)
OSHIMI KATSUHIKO (JP)
SUNAGA TAKAO (JP)
NAKANISHI MASATAKA (JP)
Application Number:
PCT/JP2007/069494
Publication Date:
April 24, 2008
Filing Date:
October 04, 2007
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
KAWAI KOICHI (JP)
OSHIMI KATSUHIKO (JP)
SUNAGA TAKAO (JP)
NAKANISHI MASATAKA (JP)
KAWAI KOICHI (JP)
OSHIMI KATSUHIKO (JP)
SUNAGA TAKAO (JP)
NAKANISHI MASATAKA (JP)
International Classes:
C08G59/06
Foreign References:
| JP2000290351A | 2000-10-17 | |||
| JP2000212255A | 2000-08-02 | |||
| JP2000154235A | 2000-06-06 | |||
| JPH10279669A | 1998-10-20 | |||
| JPH10279666A | 1998-10-20 | |||
| JPH07196568A | 1995-08-01 | |||
| JPH07237141A | 1995-09-12 | |||
| JPH07238142A | 1995-09-12 |
Attorney, Agent or Firm:
SUGIMURA, Kenji et al. (3-2-1 Kasumigaseki, Chiyoda-ku, Tokyo 13, JP)
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