EPOXY RESIN MIXTURE, EPOXY RESIN COMPOSITION, CURED PRODUCT AND SEMICONDUCTOR DEVICE

Title:

EPOXY RESIN MIXTURE, EPOXY RESIN COMPOSITION, CURED PRODUCT AND SEMICONDUCTOR DEVICE

Document Type and Number:

WIPO Patent Application WO/2015/037590

Kind Code:

A1

Abstract:

Provided is an epoxy resin mixture capable of simultaneously satisfying properties such as the cured product having excellent heat resistance while also having excellent mechanical strength, flame resistance and high temperature elastic modulus and the mixture having low viscosity before curing, properties that conflict with said heat resistance. The epoxy resin mixture is obtained by reacting a phenol resin (A) represented by formula (1) and biphenol (B) simultaneously with an epihalohydrin. (1) (In the formula, the ratio (mole ratio) of (a) to (b) is (a)/(b)= 1 to 3 and n represents the number of repetitions.)

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Inventors:

NAKANISHI MASATAKA (JP)
HASEGAWA ATSUHIKO (JP)
KIMURA MASAMITSU (JP)

Application Number:

PCT/JP2014/073827

Publication Date:

March 19, 2015

Filing Date:

September 09, 2014

Export Citation:

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Assignee:

NIPPON KAYAKU KK (JP)

International Classes:

C08G59/38; H01L23/29; H01L23/31

Domestic Patent References:

WO2009110424A1

2009-09-11

Foreign References:

JP2013043958A	2013-03-04
JPH01230619A	1989-09-14
JP2006045261A	2006-02-16
JP2000191885A	2000-07-11
JP2008156553A	2008-07-10
JP2011252037A	2011-12-15

Attorney, Agent or Firm:

Shin-Ei Patent Firm, P. C. (JP)
Patent business corporation Shin-Ei Patent Firm (JP)

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