Title:
EPOXY RESIN MIXTURE, EPOXY RESIN COMPOSITION AND CURED PRODUCT OF SAME
Document Type and Number:
WIPO Patent Application WO/2018/117150
Kind Code:
A1
Abstract:
Provided are: an epoxy resin mixture which has high heat resistance and excellent electrical reliability; an epoxy resin composition; and a cured product of the epoxy resin composition. An epoxy resin mixture according to the present invention is represented by formula (1). (In the formula, each R1 is independently present and represents a hydrogen atom, an alkyl group having 1-6 carbon atoms or an alkoxy group having 1-6 carbon atoms; each A is independently present and represents a hydrogen atom, a glycidyl group or a group selected from among the structures described below; and n represents an integer of 0-5.)
More Like This:
Inventors:
NAKANISHI MASATAKA (JP)
HASEGAWA ATSUHIKO (JP)
HASEGAWA ATSUHIKO (JP)
Application Number:
PCT/JP2017/045727
Publication Date:
June 28, 2018
Filing Date:
December 20, 2017
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
C08G59/32
Domestic Patent References:
| WO2013183735A1 | 2013-12-12 | |||
| WO2015037584A1 | 2015-03-19 | |||
| WO2016014536A1 | 2016-01-28 | |||
| WO2016031643A1 | 2016-03-03 | |||
| WO2017170521A1 | 2017-10-05 |
Foreign References:
| JP2016044229A | 2016-04-04 | |||
| GB1158606A | 1969-07-16 | |||
| JP2005290378A | 2005-10-20 |
Attorney, Agent or Firm:
SHIN-EI PATENT FIRM, P.C. (JP)
Download PDF: