Title:
EPOXY RESIN, EPOXY RESIN MIXTURES, EPOXY RESIN COMPOSITIONS AND PRODUCTS OF CURING OF THE SAME
Document Type and Number:
WIPO Patent Application WO/2002/031017
Kind Code:
A1
Abstract:
The invention aims at providing a low-viscosity epoxy resin and epoxy resin compositions which can give products of curing excellent in heat resistance. The invention is characterized by using an epoxy resin obtained by reacting 5-methylresorcinol with an epihalohydrin in the presence of an alkali metal hydroxide.
Inventors:
AKATSUKA YASUMASA (JP)
NAKAYAMA KOJI (JP)
OSHIMI KATSUHIKO (JP)
TOMIDA SYOUICHI (JP)
NAKAYAMA KOJI (JP)
OSHIMI KATSUHIKO (JP)
TOMIDA SYOUICHI (JP)
Application Number:
PCT/JP2001/008884
Publication Date:
April 18, 2002
Filing Date:
October 10, 2001
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
AKATSUKA YASUMASA (JP)
NAKAYAMA KOJI (JP)
OSHIMI KATSUHIKO (JP)
TOMIDA SYOUICHI (JP)
AKATSUKA YASUMASA (JP)
NAKAYAMA KOJI (JP)
OSHIMI KATSUHIKO (JP)
TOMIDA SYOUICHI (JP)
International Classes:
C07D301/26; C08G59/06; (IPC1-7): C08G59/06; C08L63/00; C08K3/00; C07D303/27; C07D301/26
Foreign References:
JPS6147717A | 1986-03-08 | |||
JPH11255867A | 1999-09-21 | |||
JPH051265A | 1993-01-08 | |||
JPS51143633A | 1976-12-10 | |||
EP0013532A1 | 1980-07-23 |
Other References:
See also references of EP 1266919A4
None
None
Attorney, Agent or Firm:
Kawaguchi, Yoshio (1-11 Shinjuku 1-chome Shinjuku-ku, Tokyo, JP)
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