Title:
EPOXY RESIN MOLDING MATERIAL, MOLDED ARTICLE, MOLDED CURED ARTICLE, AND METHOD FOR MANUFACTURING MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2016/104788
Kind Code:
A1
Abstract:
Provided is an epoxy resin molding material comprising: an epoxy resin A which has a mesogenic skeleton and a phase transition temperature of less than 140°C; a curing agent; and an inorganic filler.
Inventors:
TANAKA KENJI (JP)
YOSHIDA YUKA (JP)
KOSUGI SHINICHI (JP)
KATAGI HIDEYUKI (JP)
SUE HARUAKI (JP)
TAKEZAWA YOSHITAKA (JP)
YOSHIDA YUKA (JP)
KOSUGI SHINICHI (JP)
KATAGI HIDEYUKI (JP)
SUE HARUAKI (JP)
TAKEZAWA YOSHITAKA (JP)
Application Number:
PCT/JP2015/086414
Publication Date:
June 30, 2016
Filing Date:
December 25, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C08L63/00; C08G59/24; C08G59/62; C08J5/00; C08K3/20; C08K5/54
Foreign References:
| JP2013227451A | 2013-11-07 | |||
| JP2009215390A | 2009-09-24 | |||
| JP2014214307A | 2014-11-17 |
Attorney, Agent or Firm:
Taiyo, Nakajima & Kato (JP)
Patent business corporation solar international patent firm (JP)
Patent business corporation solar international patent firm (JP)
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