Title:
EPOXY RESIN, PHENOL RESIN, THEIR PRODUCTION METHODS, EPOXY RESIN COMPOSITION AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2008/041749
Kind Code:
A1
Abstract:
Disclosed is an epoxy resin having excellent fluidity and high filler filling property, which provides a cured product excellent in moisture resistance, heat resistance and flame retardance. This epoxy resin is suitable for sealing of electronic components and uses as circuit board materials. Also disclosed is a composition of such an epoxy resin. Specifically disclosed is an epoxy resin represented by the general formula (3) below, which is obtained by reacting epichlorohydrin with a phenol resin which is obtained by reacting 0.2-6.0 moles of indene or acenaphthylene with 1 mole of a bisphenol compound represented by the general formula (2) below. (In the formulae, X represents a single bond, -CH2-, -CH(CH3)-, -C(CH3)2-, -CO-, -O-, -S- or -SO2-; and R1-R4 independently represent a hydrogen atom or a substituent derived from indene or acenaphthylene.)
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Inventors:
NAKAHARA KAZUHIKO (JP)
KAJI MASASI (JP)
KAJI MASASI (JP)
Application Number:
PCT/JP2007/069482
Publication Date:
April 10, 2008
Filing Date:
October 04, 2007
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL CO (JP)
NAKAHARA KAZUHIKO (JP)
KAJI MASASI (JP)
NAKAHARA KAZUHIKO (JP)
KAJI MASASI (JP)
International Classes:
C08G8/30; C08G59/06
Domestic Patent References:
| WO2003104295A1 | 2003-12-18 |
Foreign References:
| JP2000204141A | 2000-07-25 |
Attorney, Agent or Firm:
NARUSE, Katsuo et al. (TKK Nishishinbashi Bldg.11-5, Nishi-shinbashi 2-chome,Minato-k, Tokyo 03, JP)
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