Title:
ETCHING LIQUID FOR SILVER, AND METHOD FOR PRODUCING PRINTED WIRING BOARD USING SAME
Document Type and Number:
WIPO Patent Application WO/2020/171051
Kind Code:
A1
Abstract:
The present invention provides an etching liquid for silver, which is an aqueous solution containing a carboxylic acid, hydrogen peroxide and an alcohol. The present invention also provides a method for producing a printed wiring board, the method having a step for forming a silver layer (M1) as a plating underlayer on an insulating base material (A) and then removing unwanted parts of the silver layer (M1) using the etching liquid for silver. By using the etching liquid for silver, it is possible to efficiently remove unwanted plating underlayer in the production of a printed wiring board in which silver is used in the plating underlayer, and obtain a printed wiring board having little side etching and undercutting in wiring parts of the printed wiring board.
Inventors:
NIIBAYASHI SHOTA (JP)
MURAKAWA AKIRA (JP)
FUKAZAWA NORIMASA (JP)
SHIRAKAMI JUN (JP)
MURAKAWA AKIRA (JP)
FUKAZAWA NORIMASA (JP)
SHIRAKAMI JUN (JP)
Application Number:
PCT/JP2020/006218
Publication Date:
August 27, 2020
Filing Date:
February 18, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C23F1/30; H05K3/06
Domestic Patent References:
| WO2015029478A1 | 2015-03-05 |
Foreign References:
| CN108048842A | 2018-05-18 | |||
| JP2012194024A | 2012-10-11 | |||
| JP2009162727A | 2009-07-23 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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