Title:
ETCHING METHOD, ETCHING APPARATUS, AND RING MEMBER
Document Type and Number:
WIPO Patent Application WO/2011/090109
Kind Code:
A1
Abstract:
Disclosed is an etching method which includes: a step wherein a substrate is carried into a treatment chamber, and the substrate is placed on a placing table; a step wherein, a treatment gas is jetted in a shower-like manner from a gas supply section facing the substrate, in a state wherein a ring member is disposed to surround the substrate, said ring member having the main component of at least the surface portion being the same as the main component of a substrate film to be etched, and the film to be etched is etched by having the treatment gas in the plasma state; and a step wherein the inside of the treatment chamber is subjected to vacuum through an air-releasing path. Thus, nonuniformity of the distribution of active species in the plasma close to the circumferential end portion of the substrate is suppressed.
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Inventors:
SUZUKI AYUTA (JP)
KANG SONGYUN (JP)
MORIYA TSUYOSHI (JP)
TERASAWA NOBUTOSHI (JP)
OKABE YOSHIAKI (JP)
KANG SONGYUN (JP)
MORIYA TSUYOSHI (JP)
TERASAWA NOBUTOSHI (JP)
OKABE YOSHIAKI (JP)
Application Number:
PCT/JP2011/050960
Publication Date:
July 28, 2011
Filing Date:
January 20, 2011
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
SUZUKI AYUTA (JP)
KANG SONGYUN (JP)
MORIYA TSUYOSHI (JP)
TERASAWA NOBUTOSHI (JP)
OKABE YOSHIAKI (JP)
SUZUKI AYUTA (JP)
KANG SONGYUN (JP)
MORIYA TSUYOSHI (JP)
TERASAWA NOBUTOSHI (JP)
OKABE YOSHIAKI (JP)
International Classes:
H01L21/3065
Foreign References:
| JPH07245292A | 1995-09-19 |
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
Katsunuma Hirohito (JP)
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Claims: