Title:
ETCHING METHOD AND ETCHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/022045
Kind Code:
A1
Abstract:
This etching method includes: a film forming step for forming a second film on an object to be processed that has a film to be processed, a layer having a plurality of upwardly protruding parts formed on the film to be processed, and a first film covering the upwardly protruding parts and the film to be processed exposed between the plurality of upwardly protruding parts; a first etching step for etching the second film in a state with the second film left remaining on a portion of the first film covering the side surface of each upwardly protruding part; and a second etching step for exposing the top part of each upwardly protruding part and the film to be processed between the plurality of upwardly protruding parts by etching the first film in a state with the second film left remaining on the portion of the first film covering the side surfaces of the upwardly protruding parts.
Inventors:
YANAGISAWA YUSUKE (JP)
TAKINO YUSUKE (JP)
TAKINO YUSUKE (JP)
Application Number:
PCT/JP2019/027078
Publication Date:
January 30, 2020
Filing Date:
July 09, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/3065; H01L21/3213; H01L21/768; H05H1/46
Domestic Patent References:
| WO2010134176A1 | 2010-11-25 |
Foreign References:
| JP2009130035A | 2009-06-11 | |||
| JP2009152243A | 2009-07-09 | |||
| JP2014045077A | 2014-03-13 | |||
| JP2012054343A | 2012-03-15 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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