Title:
EXPANDABLE RESOL-TYPE PHENOLIC RESIN MOLDING MATERIAL, METHOD FOR PRODUCING THE SAME, AND PHENOLIC RESIN FOAM
Document Type and Number:
WIPO Patent Application WO/2010/082646
Kind Code:
A1
Abstract:
Provided is an expandable resol-type phenolic resin molding material comprising a liquid resol-type phenol resin, foaming agent, foam regulator, acid curing agent, and additive, particularly an expandable resol-type phenolic resin molding material wherein the additive is a nitrogen-containing crosslinked cyclic compound having an average grain size of 80 µm or smaller. Also provided is a phenolic resin foam obtained by foaming and curing the molding material.
Inventors:
TAKAHASHI HIROO (JP)
Application Number:
PCT/JP2010/050461
Publication Date:
July 22, 2010
Filing Date:
January 12, 2010
Export Citation:
Assignee:
ASAHI ORGANIC CHEM IND (JP)
TAKAHASHI HIROO (JP)
TAKAHASHI HIROO (JP)
International Classes:
C08L61/06; C08J9/04; C08K5/053; C08K5/3447
Foreign References:
| JP2007070507A | 2007-03-22 | |||
| JP2006335868A | 2006-12-14 | |||
| JP2000230070A | 2000-08-22 | |||
| JPH0445874A | 1992-02-14 | |||
| JPS60161438A | 1985-08-23 | |||
| JPS60149639A | 1985-08-07 |
Other References:
See also references of EP 2380931A4
Attorney, Agent or Firm:
NAKAMURA, SHIZUO (JP)
Shizuo Nakamura (JP)
Shizuo Nakamura (JP)
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