Title:
EXTRUSION MOLDING DEVICE, SYSTEM FOR PRODUCING FILM AND METHOD FOR PRODUCING FILM
Document Type and Number:
WIPO Patent Application WO/2021/256006
Kind Code:
A1
Abstract:
This extrusion molding device 2 comprises: a first flow path 231 through which a first molten resin passes; a second flow path 232 and a third flow path 233, through which a second molten resin passes; a first manifold 234; and an ejection port 241 from which the first molten resin and the second molten resin, said resins having passed through the first manifold 234, are ejected. The second flow path 232 is connected to one end part of the first manifold 234 in the transverse direction TD. The third flow path 233 is connected to the other end part of the first manifold 234 in the transverse direction TD.
Inventors:
OMAE MICHIHIRO (JP)
YAMASHITA YUJI (JP)
YAMASHITA YUJI (JP)
Application Number:
PCT/JP2021/006671
Publication Date:
December 23, 2021
Filing Date:
February 22, 2021
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
B29C48/19; B29C48/305; B29C48/49; B29C48/495
Domestic Patent References:
| WO2016043117A1 | 2016-03-24 |
Foreign References:
| JP2006159804A | 2006-06-22 | |||
| JP2006130744A | 2006-05-25 |
Attorney, Agent or Firm:
OKAMOTO, Hiroyuki et al. (JP)
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