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Patent Searching and Data


Title:
FABRICATION OF THICK FILM ELECTRICAL COMPONENTS
Document Type and Number:
WIPO Patent Application WO2005020249
Kind Code:
A3
Abstract:
A thick-film resistor component (1A, 50) may include a thick film component (1A, 54) formed between a thick-film resistor (1A, 60) and an electrically conductive sheet (1A, 52), wherein a portion of the sheet (1C, 66 & 68) is selectively removed to form resistor contacts while exposing a portion of the thick-film component. Electrical terminals (1C, 52A, & 52C) to a thick-film resistor may be sized to reduce stress and/or be selectively positioned relative to the resistor to define a desired resistor value. A thick-film resistor may include one or more resistor segments configured to be selectively open-circuited to incrementally adjust the value of the resistor.

Inventors:
ZHOU JIMING (US)
SARMA DWADASI H (US)
BERLIN CARL W (US)
MYERS JOHN D (US)
FAIRCHILD RAY M (US)
Application Number:
PCT/US2004/024773
Publication Date:
September 29, 2005
Filing Date:
August 02, 2004
Export Citation:
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Assignee:
DELPHI TECH INC (US)
ZHOU JIMING (US)
SARMA DWADASI H (US)
BERLIN CARL W (US)
MYERS JOHN D (US)
FAIRCHILD RAY M (US)
International Classes:
H01C7/00; H01C17/065; H05K1/16; H05K1/02; H05K1/09; H05K3/40; H05K3/46; (IPC1-7): H01C17/00; H01C17/02; H01C17/28; H01C1/012
Foreign References:
US6136512A2000-10-24
US4901052A1990-02-13
US5256836A1993-10-26
US5548268A1996-08-20
Other References:
See also references of EP 1661147A4
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