Title:
FePt SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2013/105648
Kind Code:
A1
Abstract:
Provided are an FePt sputtering target with which it is possible to eliminate the use of multiple targets and use only a thin film comprising an FePt alloy that is suitable as a magnetic recording medium, and a method for producing the same. The FePt sputtering target comprises Fe, Pt and a metal oxide, as well as one or more metal elements other than Fe and Pt, in a dispersed structure of an FePt alloy phase, which is formed from at least 40 at% but less than 60 at% of Pt and Fe and more than 0 at% but 20 at% or less of one or more metal elements other than Fe and Pt such that the total of the Pt and the one or more metal elements is 60 at% or less, with Fe and inevitable impurities as the balance, and a metal oxide phase comprising inevitable impurities. The metal oxide content in terms of the entire target is 20 to 40 vol%.
Inventors:
MIYASHITA TAKANOBU (JP)
GOTO YASUYUKI (JP)
YAMAMOTO TAKAMICHI (JP)
KUSHIBIKI RYOUSUKE (JP)
AONO MASAHIRO (JP)
NISHIURA MASAHIRO (JP)
GOTO YASUYUKI (JP)
YAMAMOTO TAKAMICHI (JP)
KUSHIBIKI RYOUSUKE (JP)
AONO MASAHIRO (JP)
NISHIURA MASAHIRO (JP)
Application Number:
PCT/JP2013/050430
Publication Date:
July 18, 2013
Filing Date:
January 11, 2013
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND (JP)
International Classes:
C23C14/34; B22F9/08; C22C1/05; C22C5/04; C22C32/00; G11B5/851
Domestic Patent References:
WO2012029498A1 | 2012-03-08 | |||
WO2012086335A1 | 2012-06-28 |
Foreign References:
JP2003313659A | 2003-11-06 | |||
JP2011208167A | 2011-10-20 | |||
JP2006161082A | 2006-06-22 |
Other References:
W.B.MI ET AL.: "Characterization of Cu additive FePt-C granular films", APPLIED SURFACE SCIENCE, vol. 252, 18 January 2006 (2006-01-18), pages 8688 - 8694, XP005671105
Attorney, Agent or Firm:
MATSUYAMA, Keisuke et al. (JP)
Keisuke Matsuyama (JP)
Keisuke Matsuyama (JP)
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