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Patent Searching and Data


Title:
FIBER AGGREGATE FOR MOLDING
Document Type and Number:
WIPO Patent Application WO/2023/074841
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a fiber aggregate that is for a molded article having good appearance, and that has excellent stiffness and strength against bending, excellent impact resistance, and can be used to provide a molded article having good appearance. The purpose of the present invention is to further provide: a pre-sheet obtained from the fiber aggregate for a molded article; and a molded article. The fiber aggregate for molding according to the present invention contains a fiber component and a thermal fusion bonding resin component. The fiber component contains pulp fibers and polypropylene fibers. The thermal fusion bonding resin component contains at least one selected from the group consisting of polyethylenes and acid-modified polyethylenes. The contained amount of the thermal fusion bonding resin component in the fiber aggregate is 3-18 mass%. The T/Y ratio of the fiber aggregate is 0.5-1.5, where T represents the tensile strength of the fiber aggregate in a first direction, and Y represents the tensile strength of the fiber aggregate in a second direction perpendicular to the first direction.

Inventors:
KAJITA KEIICHI (JP)
NAKAYAMA YASUFUMI (JP)
ISOGAI TAKUYA (JP)
FUSHIMI HAYATO (JP)
YAMANAKA MIO (JP)
SHISHIDO RINA (JP)
SAKAI MIZUKI (JP)
OKUDA KEIKO (JP)
SHIRAO TAKESHI (JP)
MINAMI TAKEHIRO (JP)
Application Number:
PCT/JP2022/040341
Publication Date:
May 04, 2023
Filing Date:
October 28, 2022
Export Citation:
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Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
D04H1/26; B29B11/16; B29B15/08; B29C43/34; B29C45/00; B29C70/06; B29C70/42; B32B5/28; B32B7/022; B32B23/02; B32B23/10; C08J5/04; C08J5/18; D04H1/425; D04H1/4291; D04H1/4382; D04H1/542; D04H1/58; B29K105/12
Domestic Patent References:
WO2017094850A12017-06-08
Foreign References:
JP2017082366A2017-05-18
US20020068081A12002-06-06
JP2020037710A2020-03-12
JP2020519781A2020-07-02
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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