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Title:
METHOD FOR MANUFACTURING PULP-FIBER-CONTAINING RESIN PELLET AND METHOD FOR MANUFACTURING MOLDED BODY
Document Type and Number:
WIPO Patent Application WO/2023/074842
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a method for manufacturing a pulp-fiber-containing resin pellet that has excellent rigidity and strength against bending and provides a molded body having excellent shock resistance. In addition, the purpose of the present invention is to provide a method for manufacturing a molded body using the pulp-fiber-containing resin pellet. The method for manufacturing a pulp-fiber-containing resin pellet according to the present invention includes the following step 1, step 2, and step 3-1 in this order, or contains step 1, step 2, and step 3-2 in this order. Step 1: A fiber assembly manufacturing step for manufacturing a fiber assembly containing pulp fibers and a resin A by dry papermaking; Step 2: A fiber assembly sheet manufacturing step for manufacturing a fiber assembly sheet by compressing the fiber assembly; Step 3-1: A pulp-fiber-containing resin pellet manufacturing step for manufacturing a pellet by melting and kneading the fiber assembly sheet; and Step 3-2: A pulp-fiber-containing resin pellet manufacturing step for cutting the fiber assembly sheet

Inventors:
KAJITA KEIICHI (JP)
NAKAYAMA YASUFUMI (JP)
ISOGAI TAKUYA (JP)
FUSHIMI HAYATO (JP)
YAMANAKA MIO (JP)
SHISHIDO RINA (JP)
SAKAI MIZUKI (JP)
OKUDA KEIKO (JP)
SHIRAO TAKESHI (JP)
YAMAGUCHI SAKIKO (JP)
Application Number:
PCT/JP2022/040342
Publication Date:
May 04, 2023
Filing Date:
October 28, 2022
Export Citation:
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Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
B29B9/06; B29B9/04; B29B9/14; B29B11/16; B29B15/08; B29C43/34; B29C45/00; B29C70/06; B29C70/42; C08J3/12; C08J5/04; C08J5/18; B29K105/12
Domestic Patent References:
WO2009072499A12009-06-11
WO2008133214A12008-11-06
Foreign References:
JP2001316486A2001-11-13
JP2013245328A2013-12-09
JP2002144329A2002-05-21
JP2009508708A2009-03-05
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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