FIBER-REINFORCED COMPOSITE RESIN COMPOSITION, AND ADHESIVE AND SEALING AGENT

WIPO Patent Application WO/2007/049666

A1

Disclosed is a fiber-reinforced composite resin composition which can be used as a sealing agent, an adhesive or a filler, specifically a fiber-reinforced composite resin composition which has low thermal expansion, high strength light weight and high thermal conductivity at such levels that have been required recently, particularly which has a high isotropic thermal conductivity at a satisfactory level. The composition comprises a fiber having an average fiber diameter of 4 to 200 nm. When the composition is cured in a plate-like shape, the cured product has a total light transmittance of 70% or higher per 50 µm thickness as measured at an wavelength of 400 to 700 nm and thermal conductivities both in a thickness-wise direction and a plane-wise direction of 0.4 W/m. K or higher. In the cured product, the fiber is oriented randomly.

YANO HIROYUKI (JP)
NOGI MASAYA (JP)
IFUKU SHINSUKE (JP)
ABE KENTARO (JP)
TAKEZAWA YOSHITAKA (JP)
HANDA KEISHIN (JP)

PCT/JP2006/321322

May 03, 2007

October 26, 2006

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UNIV KYOTO (JP)
ROHM CO LTD (JP)
MITSUBISHI CHEM CORP (JP)
HITACHI LTD (JP)
PIONEER CORP (JP)
YANO HIROYUKI (JP)
NOGI MASAYA (JP)
IFUKU SHINSUKE (JP)
ABE KENTARO (JP)
TAKEZAWA YOSHITAKA (JP)
HANDA KEISHIN (JP)

C08L101/00; C08K7/02; C08L1/00; C09J101/00; C09J201/00

WO2006082964A1	2006-08-10
WO2005012404A1	2005-02-10

JP2005060680A	2005-03-10
JPH09509694A	1997-09-30
JPH09124950A	1997-05-13

ISONO, Michizo (Sabo-Kaikan Annex 7-4, Hirakawa-cho 2-chome, Chiyoda-k, Tokyo 93, JP)

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