Title:
FILLER DISPOSITION FILM
Document Type and Number:
WIPO Patent Application WO/2022/202987
Kind Code:
A1
Abstract:
The present invention enhances the transparency of a structure with which a small first article such as a µLED electrode and a second article such as a transparent display substrate are connected, said connection structure being obtained by connecting the first article and the second article using a filler arrangement film. On a filler arrangement film 1A used to this end, a filler 2 is disposed on an insulating adhesive layer 10. High-density regions 4 of filler are orderly spaced apart, and a plurality of uneven distribution regions 3 of the filler 2 are formed in the high-density regions 4. The average visible light transmittance of the filler arrangement film is 40% or greater.
Inventors:
TSUKAO REIJI (JP)
NODA DAIKI (JP)
SHIRAIWA TOSHIKI (JP)
NODA DAIKI (JP)
SHIRAIWA TOSHIKI (JP)
Application Number:
PCT/JP2022/013939
Publication Date:
September 29, 2022
Filing Date:
March 24, 2022
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
H01B5/16; G09F9/00; G09F9/30; H01L21/60; H01L33/62; H01R11/01
Foreign References:
| JP2020177916A | 2020-10-29 | |||
| JPS62188184A | 1987-08-17 | |||
| JP2017004715A | 2017-01-05 | |||
| JPH087957A | 1996-01-12 | |||
| US20180145236A1 | 2018-05-24 |
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
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