Title:
FILM WITH ARRANGED FILLER
Document Type and Number:
WIPO Patent Application WO/2022/202988
Kind Code:
A1
Abstract:
Provided is a film with an arranged filler, wherein the filler, e.g., electroconductive particles, has been arranged on an insulating resin layer. In cases when the film with an arranged filler is used to connect a connection portion of a first article which is fine, e.g., an electrode of a μ-LED, to a connection portion of a second article, e.g., an electrode of a substrate for large-screen televisions, by the filler and even when the first article and the second article have an alignment difference of about ±10%, then each connection portion can be made to actually capture at least one filler particle without fail. This film 1 includes an insulating resin layer 10 and a filler 2 arranged thereon. On the insulating resin layer 10, a plurality of particles of the filler 2 constitute a first group 3, a plurality of such first groups 3 are grouped together to constitute a second group 4, and such second groups 4 have been regularly arranged. The shortest distance L1 between the second groups 4 is longer than the shortest distance L2 between the first groups. The shortest distance L2 between the first groups is longer than the shortest distance L3 between the filler particles in the first groups.
Inventors:
NODA DAIKI (JP)
TSUKAO REIJI (JP)
TSUKAO REIJI (JP)
Application Number:
PCT/JP2022/013940
Publication Date:
September 29, 2022
Filing Date:
March 24, 2022
Export Citation:
Assignee:
DEXERIALS CORP (JP)
International Classes:
C08J5/18; G09F9/00; G09F9/30; H01B5/16; H01L21/60; H01L33/62; H01R11/01
Foreign References:
| JP2020177916A | 2020-10-29 | |||
| JPH087957A | 1996-01-12 | |||
| US20180145236A1 | 2018-05-24 |
Attorney, Agent or Firm:
TAJIME & TAJIME (JP)
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