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Title:
FILM BULK ACOUSTIC RESONATOR AND MANUFACTURING METHOD THEREFOR, AND FILTER
Document Type and Number:
WIPO Patent Application WO/2022/100469
Kind Code:
A1
Abstract:
The present invention provides a film bulk acoustic resonator and a manufacturing method therefor, and a filter. The film bulk acoustic resonator comprises: a first substrate, an upper surface of the first substrate being provided with a first cavity; a piezoelectric lamination structure, provided on the upper surface of the first substrate and covering the first cavity, the piezoelectric lamination structure comprising, from bottom to top, a second electrode, a piezoelectric layer and a first electrode which are sequentially laminated; a groove, comprising a first groove and/or a second groove, the first groove penetrating through the first electrode and extending into or penetrating through the piezoelectric layer, and the second groove penetrating through the second electrode and extending into or penetrating through the piezoelectric layer; and a reinforcement layer, provided on at least one side of the first electrode or the second electrode at the bottom of the groove. According to the present invention, the reinforcement layer is provided at the bottom of the groove, and the reinforcement layer can reinforce the electrode in a groove region, thereby preventing breakage of a thin film-like electrode.

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Inventors:
LI WEI (CN)
HUANG HERB HE (CN)
LUO HAILONG (CN)
Application Number:
PCT/CN2021/127858
Publication Date:
May 19, 2022
Filing Date:
November 01, 2021
Export Citation:
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Assignee:
NINGBO SEMICONDUCTOR INT CORPORATION SHANGHAI BRANCH (CN)
International Classes:
H03H3/02
Foreign References:
CN112332793A2021-02-05
CN110401428A2019-11-01
CN111106812A2020-05-05
CN109889179A2019-06-14
CN111786649A2020-10-16
CN109660227A2019-04-19
US20050179508A12005-08-18
Attorney, Agent or Firm:
BEIJING SICHUANG DACHENG INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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