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Patent Searching and Data


Title:
FILM AFFIXING/CUTTING DEVICE, FILM SEPARATION DEVICE, AND LAMINATING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2023/048210
Kind Code:
A1
Abstract:
A film affixing/cutting device 1 according to an embodiment is provided with: an affixing unit 10U having an affixing member that affixes a film F fed out from a film supply roll onto a workpiece W and a cutter that cuts the film F at a position not overlapping the workpiece W; a first affixing-side cooling unit 21 disposed on the same side as the side on which the affixing unit 10U is positioned with respect to the workpiece W and the film F on the workpiece W; a second affixing-side cooling unit 22 disposed on the side opposite to the side on which the affixing unit 10U is positioned with respect to the workpiece W and the film on the workpiece W; and a cooling medium supply unit 23 that supplies air supplied by the first affixing-side cooling unit 21 and air supplied by the second affixing-side cooling unit 22 from bifurcated air flow paths 24A and 24B to the first affixing-side cooling unit 21 and the second affixing-side cooling unit 22.

Inventors:
TAKAYAMA MICHIO (JP)
MORIMUNE AYUMI (JP)
Application Number:
PCT/JP2022/035316
Publication Date:
March 30, 2023
Filing Date:
September 22, 2022
Export Citation:
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Assignee:
SHINWA CONTROLS CO LTD (JP)
International Classes:
B29C63/48; B29C63/02; B65H37/04; B65H41/00
Foreign References:
JP2006310872A2006-11-09
JP2021001321A2021-01-07
CN113418256A2021-09-21
Attorney, Agent or Firm:
MIYAJIMA Manabu et al. (JP)
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