RESIN COMPOSITION, CURED PRODUCT, RESIN SHEET, INSULATION LAYER, ELECTRIC/ELECTRONIC COMPONENT, PRINTED CIRCUIT BOARD, AND CURING AGENT FOR EPOXY RESIN

Title:

RESIN COMPOSITION, CURED PRODUCT, RESIN SHEET, INSULATION LAYER, ELECTRIC/ELECTRONIC COMPONENT, PRINTED CIRCUIT BOARD, AND CURING AGENT FOR EPOXY RESIN

Document Type and Number:

WIPO Patent Application WO/2023/048209

Kind Code:

A1

Abstract:

This resin composition contains a phenol carbonate resin (A) and an epoxy resin (B), wherein the molar ratio (epoxy groups / terminal hydroxyl groups) of the epoxy groups of the epoxy resin (B) to the terminal hydroxyl groups of the phenol carbonate resin (A) is 3.0-100,000.

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Inventors:

AONO YOHEI (JP)
WATANABE TAKAAKI (JP)
KIDA NORIYUKI (JP)
NISHIMURA MASANARI (JP)
YOKOGI MASASHI (JP)
YAYAMA YUICHI (JP)

Application Number:

PCT/JP2022/035310

Publication Date:

March 30, 2023

Filing Date:

September 22, 2022

Export Citation:

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Assignee:

MITSUBISHI CHEM CORP (JP)

International Classes:

C08G59/40; C08G64/04; C08L63/00; C08L69/00; H05K1/03

Domestic Patent References:

WO2020075611A1

2020-04-16

Foreign References:

JP2003165897A	2003-06-10
JPH03237119A	1991-10-23
JPH0967428A	1997-03-11
JP2019035056A	2019-03-07
JPS63258949A	1988-10-26

Attorney, Agent or Firm:

IP FIRM SHUWA (JP)

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