Title:
FILM FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/217555
Kind Code:
A1
Abstract:
[Problem] To obtain a technique whereby a small-sized LVF can be obtained with good efficiency. [Solution] A sputtering device 100 for forming an optical thin film on a substrate 107, the sputtering device 100 being provided with a carrier 108 for retaining the substrate 107, and a mask 110 for covering a portion of the substrate 107 in a state in which a space 111 into which particles constituting an optical thin film can penetrate is present between the substrate 107 and the mask 110, the mask 110 being fixed to the carrier 108.
Inventors:
AKIBA MASAHIRO (JP)
Application Number:
PCT/JP2017/022448
Publication Date:
December 21, 2017
Filing Date:
June 19, 2017
Export Citation:
Assignee:
TOPCON CORP (JP)
International Classes:
C23C14/04; G02B5/28
Foreign References:
| JP2009003348A | 2009-01-08 | |||
| JP2009102718A | 2009-05-14 |
Attorney, Agent or Firm:
SUENARI, Mikio (JP)
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