Title:
FILM FORMING DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/235442
Kind Code:
A1
Abstract:
A film forming device relating to one embodiment of the present invention is provided with: a film forming space, i.e., a film forming chamber; a film forming treatment anterior chamber; a raw material supply port for supplying a raw material to the film forming space; an opening for measuring the temperature of a wafer placed on a wafer placing surface of a placing table disposed in the film forming space; and a partitioning plate that partitions the film forming space and the film forming treatment anterior chamber from each other. The raw material supply port is positioned in a same plane where the partitioning plate is disposed, or on the side further toward the film forming space than the partitioning plate, and the opening is positioned on the side further toward the film forming treatment anterior chamber than the partitioning plate.
Inventors:
FUKADA KEISUKE (JP)
ISHIBASHI NAOTO (JP)
ATSUMI HIRONORI (JP)
ISHIBASHI NAOTO (JP)
ATSUMI HIRONORI (JP)
Application Number:
PCT/JP2018/017937
Publication Date:
December 27, 2018
Filing Date:
May 09, 2018
Export Citation:
Assignee:
SHOWA DENKO KK (JP)
International Classes:
H01L21/205; C23C16/44
Foreign References:
| JP2010141060A | 2010-06-24 | |||
| JP2012015378A | 2012-01-19 | |||
| JP2011231388A | 2011-11-17 | |||
| JP2011146537A | 2011-07-28 | |||
| JP2007043022A | 2007-02-15 | |||
| JP2012018985A | 2012-01-26 | |||
| JP2013251479A | 2013-12-12 | |||
| JP2001081569A | 2001-03-27 | |||
| JPH04364719A | 1992-12-17 | |||
| JPH08236450A | 1996-09-13 |
Attorney, Agent or Firm:
OIKAWA Shu et al. (JP)
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