Title:
FILM-FORMING MATERIAL FOR LITHOGRAPHY, COMPOSITION FOR FORMING FILM FOR LITHOGRAPHY, UNDERLAYER FILM FOR LITHOGRAPHY, AND METHOD FOR FORMING PATTERN
Document Type and Number:
WIPO Patent Application WO/2021/029320
Kind Code:
A1
Abstract:
This film-forming material for lithography contains a compound having a group represented by formula (0). Said film-forming material for lithography can be applied to a wet process and is useful for forming a photoresist underlayer film having excellent etching resistance.
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Inventors:
OKADA YU (JP)
HORIUCHI JUNYA (JP)
ECHIGO MASATOSHI (JP)
HORIUCHI JUNYA (JP)
ECHIGO MASATOSHI (JP)
Application Number:
PCT/JP2020/030178
Publication Date:
February 18, 2021
Filing Date:
August 06, 2020
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
C08F26/06; G03F7/039; G03F7/11; G03F7/20; H01L21/027
Foreign References:
JP2007051196A | 2007-03-01 | |||
JP2015049419A | 2015-03-16 | |||
JP2018536757A | 2018-12-13 |
Attorney, Agent or Firm:
YAMAMOTO, Osamu et al. (JP)
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