Title:
SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/029321
Kind Code:
A1
Abstract:
A semiconductor device 1a comprises: a package 100 having a rectangular shape when viewed in plan and including a first side 101, a second side 102 parallel to the first side 101, a third side 103 orthogonal to the first side 101 and the second side 102, and a fourth side 104 parallel to the third side 103 and orthogonal to the first side 101 and the second side 102; a power supply terminal PVIN1 (or PVIN2) provided on the first side 101; a power ground terminal PGND1 (or PGND2) provided on the second side 102; a switch output terminal SW1 (or SW2) provided on the second side 102; an upper switch 11H connected between the power supply terminal PVIN1 (or PVIN2) and the switch output terminal SW1 (or SW2); and a lower switch 11L connected between the switch output terminal SW1 (or SW2) and the power ground terminal PGND1 (or PGND2).
Inventors:
AOKI AKIRA (JP)
TAKAGIMOTO SHINSUKE (JP)
NAKAYAMA MASAAKI (JP)
TAKAGIMOTO SHINSUKE (JP)
NAKAYAMA MASAAKI (JP)
Application Number:
PCT/JP2020/030189
Publication Date:
February 18, 2021
Filing Date:
August 06, 2020
Export Citation:
Assignee:
ROHM CO LTD (JP)
International Classes:
H01L25/07; H01L23/36; H02M3/155
Domestic Patent References:
| WO2018096573A1 | 2018-05-31 | |||
| WO2013115315A1 | 2013-08-08 | |||
| WO2012143964A1 | 2012-10-26 |
Foreign References:
| JP2017188517A | 2017-10-12 | |||
| JP2019067857A | 2019-04-25 | |||
| JP2019079935A | 2019-05-23 |
Attorney, Agent or Firm:
SANO PATENT OFFICE (JP)
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