Title:
FILM FORMING METHOD AND PROCESSING SYSTEM
Document Type and Number:
WIPO Patent Application WO/2010/004998
Kind Code:
A1
Abstract:
Provided is a film forming method wherein a film is formed on a surface of a subject, which is to be processed and has a recessed section on a surface, in a processing container which is subjected to a vacuum. The film forming method has a step of forming a film containing a transition metal, wherein a film containing a transition metal is formed by heat treatment by using a raw material gas containing the transition metal, and a metal film forming step of forming a metal film which contains a group VIII element in the element periodical table.
Inventors:
MATSUMOTO KENJI (JP)
MIZUSAWA YASUSHI (JP)
MIZUSAWA YASUSHI (JP)
Application Number:
PCT/JP2009/062380
Publication Date:
January 14, 2010
Filing Date:
July 07, 2009
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
MATSUMOTO KENJI (JP)
MIZUSAWA YASUSHI (JP)
MATSUMOTO KENJI (JP)
MIZUSAWA YASUSHI (JP)
International Classes:
H01L21/285; C23C14/14; C23C16/18; H01L21/288; H01L21/3205; H01L23/52
Foreign References:
| JP2008047675A | 2008-02-28 | |||
| JP2007067107A | 2007-03-15 | |||
| JP2007220738A | 2007-08-30 | |||
| JP2007141927A | 2007-06-07 | |||
| JP2006080234A | 2006-03-23 | |||
| JPH10229084A | 1998-08-25 | |||
| JP2008031541A | 2008-02-14 |
Attorney, Agent or Firm:
YOSHITAKE Kenji et al. (JP)
Kenji Yoshitake (JP)
Kenji Yoshitake (JP)
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