Title:
FILM FOR FORMING PROTECTIVE MEMBRANE, COMPOSITE SHEET FOR FORMING PROTECTIVE MEMBRANE, SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE EQUIPPED WITH PROTECTIVE MEMBRANE
Document Type and Number:
WIPO Patent Application WO/2023/157905
Kind Code:
A1
Abstract:
The present invention relates to: a film for forming a protective membrane, said film being formed using a resin composition containing (A) a thermoplastic resin, (B) an epoxy resin, (C) an inorganic filler, and (D) a compound containing a phosphorus atom and a nitrogen atom; a composite sheet for forming a protective membrane that uses the film for forming a protective membrane; and a semiconductor chip and semiconductor device equipped with the protective membrane.
Inventors:
WATANABE YASUTAKA (JP)
UEMURA KAZUE (JP)
UEMURA KAZUE (JP)
Application Number:
PCT/JP2023/005401
Publication Date:
August 24, 2023
Filing Date:
February 16, 2023
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
H01L21/301; C08J5/18; C08K3/013; C08K5/5399; C08L63/00; C08L101/00
Domestic Patent References:
| WO2021153414A1 | 2021-08-05 | |||
| WO2021020542A1 | 2021-02-04 |
Foreign References:
| JP2021014478A | 2021-02-12 | |||
| JP2021001338A | 2021-01-07 |
Attorney, Agent or Firm:
OHTANI PATENT OFFICE (JP)
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