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Patent Searching and Data


Title:
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIVE SHEET, AND LAYERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2023/157904
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a pressure-sensitive adhesive sheet which exhibits excellent adhesion to an adherend even in a moist heat environment and in which whitening is suppressed. The present invention relates to a pressure-sensitive adhesive composition which contains a (meth)acrylic polymer having a glass transition temperature of 0ºC or lower and a polycarbodiimide. The (meth)acrylic polymer has a (meth)acrylic monomer unit having a hydroxyl group, and the content of the (meth)acrylic monomer unit having the hydroxyl group in the (meth)acrylic polymer is 20 mass% or more relative to the total mass of the (meth)acrylic polymer. The content of a (meth)acrylic monomer unit having a carboxylic acid group in the (meth)acrylic polymer is 0.1 mass% or less.

Inventors:
UENO YUMI (JP)
FUJIOKA YASUYO (JP)
Application Number:
PCT/JP2023/005397
Publication Date:
August 24, 2023
Filing Date:
February 16, 2023
Export Citation:
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Assignee:
OJI HOLDINGS CORP (JP)
International Classes:
C09J133/00; B32B27/00; C08F220/10; C09J11/06; C09J11/08; C09J133/02; C09J133/14
Domestic Patent References:
WO2022101783A12022-05-19
Foreign References:
JP2021127353A2021-09-02
US20130040123A12013-02-14
JP2020029548A2020-02-27
US20120316294A12012-12-13
JP2013104006A2013-05-30
Attorney, Agent or Firm:
SIKs & Co. (JP)
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