Title:
FILM FORMING SYSTEM, FILM FORMING METHOD, AND COMPUTER STORAGE MEDIUM
Document Type and Number:
WIPO Patent Application WO/2018/146981
Kind Code:
A1
Abstract:
A film forming system according to the present invention forms an organic film on a substrate having a pattern formed on a surface thereof and is provided with: an organic film forming unit for applying organic film formation processing to the substrate to form the organic film on the substrate; a film thickness measurement unit for measuring the film thickness of the organic film on the substrate; and an ultraviolet processing unit for applying ultraviolet radiation processing to the organic film on the substrate to remove the surface of the organic film. In the film forming system, the organic film forming unit, the film thickness measurement unit, and the ultraviolet processing unit are provided so as to be arranged in that order along the substrate transportation direction.
Inventors:
SHIMURA SATORU (JP)
ENOMOTO MASASHI (JP)
ENOMOTO MASASHI (JP)
Application Number:
PCT/JP2018/000031
Publication Date:
August 16, 2018
Filing Date:
January 04, 2018
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/312; H01L21/3065; H01L21/768
Foreign References:
| JP2014165252A | 2014-09-08 | |||
| JP2004186682A | 2004-07-02 | |||
| JPH07201823A | 1995-08-04 | |||
| JP2016015371A | 2016-01-28 | |||
| JPH09251993A | 1997-09-22 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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