Title:
FILM AND LAYERED BODY
Document Type and Number:
WIPO Patent Application WO/2020/170919
Kind Code:
A1
Abstract:
Provided are: a film having a low dielectric constant but excellent reflow heat resistance and high toughness; and a layered body using this film. Specifically, this film comprises a resin composition having blended therein: a polyarylene sulfide resin (A); an aromatic polyamide resin (B) including terephthalic acid amide as an essential repeating unit thereof; an elastomer (C) having a reactive group that can react with at least either the polyarylene sulfide resin (A) or the aromatic polyamide resin (B); and a silane coupling agent (D). This resin composition has a polyarylene sulfide resin (A) content of 50%–85% by mass and an aromatic polyamide resin (B) content of 10%–40% by mass.
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Inventors:
KOBASHI KAZUNORI (JP)
MARUYAMA YUTAKA (JP)
OOTSUBO TAKANORI (JP)
MARUYAMA YUTAKA (JP)
OOTSUBO TAKANORI (JP)
Application Number:
PCT/JP2020/005488
Publication Date:
August 27, 2020
Filing Date:
February 13, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
B29C55/12; B32B15/08; C08J5/18; C08K5/54; C08L23/26; C08L77/06; C08L81/02
Domestic Patent References:
| WO2015033856A1 | 2015-03-12 | |||
| WO2015045724A1 | 2015-04-02 | |||
| WO2007077831A1 | 2007-07-12 | |||
| WO2009096401A1 | 2009-08-06 | |||
| WO2019004169A1 | 2019-01-03 |
Foreign References:
| JP2006016587A | 2006-01-19 | |||
| JPH04227636A | 1992-08-17 |
Attorney, Agent or Firm:
OGAWA Shinji (JP)
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