Title:
FILM-LIKE CONDUCTIVE ADHESIVE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/104987
Kind Code:
A1
Abstract:
Disclosed is a film-like conductive adhesive to be used in a semiconductor device manufacturing method that includes: a step for die-bonding, via the film-like conductive adhesive, a semiconductor chip on a body on which the semiconductor chip is to be adhered; and a step for thermally curing the film-like conductive adhesive by heating the adhesive at 100-260°C for 3-300 minutes after the step for die-bonding the semiconductor chip on the body.
Inventors:
SUGO YUKI (JP)
ONISHI KENJI (JP)
ONISHI KENJI (JP)
Application Number:
PCT/JP2014/083931
Publication Date:
July 16, 2015
Filing Date:
December 22, 2014
Export Citation:
Assignee:
NITTO DENKO CORP (JP)
International Classes:
H01L21/52; C09J5/06; C09J7/10; C09J11/04; C09J201/00; H01L21/301
Foreign References:
| JP2012142370A | 2012-07-26 | |||
| JP2012142368A | 2012-07-26 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
Patent business corporation ユニアス international patent firm (JP)
Patent business corporation ユニアス international patent firm (JP)
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