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Title:
FILM, METHOD FOR MANUFACTURING SAME, AND LAMINATE
Document Type and Number:
WIPO Patent Application WO/2024/048729
Kind Code:
A1
Abstract:
The present invention provides a film comprising a layer A and a layer B on at least one side of the layer A. The dielectric loss tangent is less than or equal to 0.01 and the density of recessed portions having a depth of 0.5 μm or more in the surface of the layer B on the opposite side from the layer A side is 5 /cm2 or less. The present invention also provides a method for manufacturing the film and a laminate using the film.

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Inventors:
SASADA YASUYUKI (JP)
HARA MIYOKO (JP)
KUNIYASU SATOSHI (JP)
Application Number:
PCT/JP2023/031835
Publication Date:
March 07, 2024
Filing Date:
August 31, 2023
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
B32B15/08; B32B3/30; H05K1/03
Domestic Patent References:
WO2022163776A12022-08-04
WO2022138665A12022-06-30
WO2018163999A12018-09-13
Foreign References:
JP2000280408A2000-10-10
JP2021095520A2021-06-24
JP2020072198A2020-05-07
JPH05226796A1993-09-03
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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