Title:
FILM-SHAPE ACQUISITION DEVICE AND FILM-SHAPE ACQUISITION METHOD
Document Type and Number:
WIPO Patent Application WO/2012/117603
Kind Code:
A1
Abstract:
In this film-shape acquisition device (1), in an optical model (8) for a silicon film (86) formed on a substrate (9) having a plurality of texture convexities (870) on the top surface (871) thereof, the following are set: thin-film concavities (865) corresponding to the plurality of texture convexities (870); and thin-film convexities (860) located thereabove. Each parameter in a set of parameters representing the shapes of the thin-film convexities (860), the thin-film concavities (865), and the middle part between the thin-film convexities (860) and the thin-film concavities (865) is then expressed in terms of an effective film thickness, and by changing the parameter values by changing the effective film thickness, a theoretical spectrum is fitted to a measured spectrum. This makes it possible to easily and precisely obtain the shape of the silicon film (86).
Inventors:
FUJIWARA HIROYUKI (JP)
YAMAGUCHI SHINJI (JP)
SUGIMOTO YOSHIO (JP)
YAMAGUCHI SHINJI (JP)
SUGIMOTO YOSHIO (JP)
Application Number:
PCT/JP2011/072220
Publication Date:
September 07, 2012
Filing Date:
September 28, 2011
Export Citation:
Assignee:
DAINIPPON SCREEN MFG (JP)
FUJIWARA HIROYUKI (JP)
YAMAGUCHI SHINJI (JP)
SUGIMOTO YOSHIO (JP)
FUJIWARA HIROYUKI (JP)
YAMAGUCHI SHINJI (JP)
SUGIMOTO YOSHIO (JP)
International Classes:
G01B11/24; G01N21/21; H01L31/04
Foreign References:
| JP2010060388A | 2010-03-18 | |||
| JP2001208531A | 2001-08-03 | |||
| JP2004536314A | 2004-12-02 | |||
| JP2004157060A | 2004-06-03 |
Other References:
NOBUYUKI MATSUMOTO ET AL.: "Bunko Ellipsometry ni yoru Texture- gata a-Si:H/c-Si Hetero Setsugo Taiyo Denchi no Koseido Kozo Hyoka", DAI 71 KAI EXTENDED ABSTRACTS, 2001, pages 15A - ZB-6, XP008171703
See also references of EP 2682712A4
See also references of EP 2682712A4
Attorney, Agent or Firm:
MATSUSAKA, Masahiro et al. (JP)
Matsusaka Masahiro (JP)
Matsusaka Masahiro (JP)
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Claims:
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