Title:
FILM-SHAPED SINTERING MATERIAL FOR HEATING AND PRESSURIZATION, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/190951
Kind Code:
A1
Abstract:
This film-shaped sintering material for heating and pressurization contains metal particles and a binder component that contains a resin having a decomposition initiation temperature of 200 °C or lower.
Inventors:
NEMOTO TAKU (JP)
NISHIDA TAKUO (JP)
NAKAYAMA HIDEKAZU (JP)
KIDA SATOSHI (JP)
NISHIDA TAKUO (JP)
NAKAYAMA HIDEKAZU (JP)
KIDA SATOSHI (JP)
Application Number:
PCT/JP2023/013339
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B22F1/107; B22F1/00; B22F7/04; B22F7/08; B32B37/02; H01L23/373
Domestic Patent References:
| WO2016139831A1 | 2016-09-09 | |||
| WO2017170079A1 | 2017-10-05 | |||
| WO2019045092A1 | 2019-03-07 | |||
| WO2019092960A1 | 2019-05-16 |
Foreign References:
| JP2018098272A | 2018-06-21 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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