Title:
LAMINATED BODY MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/190950
Kind Code:
A1
Abstract:
Provided is a laminated body manufacturing method that includes: a first step in which a laminated body precursor is obtained by sandwiching, between a first adherend and a second adherend, a film-type fired material containing metal particles and a binder component; and a second step in which the laminated body precursor is heated, the atmosphere in which the laminated body precursor is present is pressurized, and the binder component is thereby decomposed and vaporized.
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Inventors:
NEMOTO TAKU (JP)
NISHIDA TAKUO (JP)
NAKAYAMA HIDEKAZU (JP)
KIDA SATOSHI (JP)
NISHIDA TAKUO (JP)
NAKAYAMA HIDEKAZU (JP)
KIDA SATOSHI (JP)
Application Number:
PCT/JP2023/013338
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
B22F7/08; B22F7/04; B32B37/00; H01L21/52
Domestic Patent References:
| WO2016139831A1 | 2016-09-09 |
Foreign References:
| JP2018152403A | 2018-09-27 | |||
| JP2008098608A | 2008-04-24 | |||
| JPH10107048A | 1998-04-24 | |||
| JP2016103524A | 2016-06-02 | |||
| JP2020122218A | 2020-08-13 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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