Title:
FILM FOR TEMPORARY FIXING, LAMINATE FOR TEMPORARY FIXING, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, COMPOSITION FOR TEMPORARY FIXING
Document Type and Number:
WIPO Patent Application WO/2024/024566
Kind Code:
A1
Abstract:
Disclosed is a film for temporary fixing, the film being used for temporarily fixing a semiconductor member and a support member. The film for temporary fixing contains an ultraviolet absorbing agent having a hydroxyl group, a thermosetting resin having a functional group that can react with the hydroxyl group, and a thermoplastic resin.
Inventors:
MIYAZAWA EMI (JP)
AKASU YUTA (JP)
ENOMOTO TETSUYA (JP)
AKASU YUTA (JP)
ENOMOTO TETSUYA (JP)
Application Number:
PCT/JP2023/026237
Publication Date:
February 01, 2024
Filing Date:
July 18, 2023
Export Citation:
Assignee:
RESONAC CORP (JP)
International Classes:
H01L21/301; H01L21/304
Domestic Patent References:
| WO2021149567A1 | 2021-07-29 | |||
| WO2021124855A1 | 2021-06-24 | |||
| WO2020111154A1 | 2020-06-04 |
Foreign References:
| JP2021061324A | 2021-04-15 | |||
| JP2015015369A | 2015-01-22 | |||
| JP2015041663A | 2015-03-02 | |||
| JP2018074115A | 2018-05-10 | |||
| JP2018063972A | 2018-04-19 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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