Title:
FILM THICKNESS ANALYSIS METHOD, FILM THICKNESS ANALYSIS DEVICE, AND RECORDING MEDIUM
Document Type and Number:
WIPO Patent Application WO/2022/168756
Kind Code:
A1
Abstract:
This film thickness analysis method includes: acquiring film thickness values at a plurality of measurement points differing from one another along the radial direction of a target film, which is formed on a target substrate to be analyzed by supplying a treatment liquid while rotating the target substrate on the basis of a prescribed liquid treatment condition; and creating an approximation formula for the film thickness distribution of the target film by approximating the film thickness values at the plurality of measurement points relative to one Zernike polynomial. When creating the approximation formula, the approximation formula is created by specifying, among the plurality of coefficients included in the Zernike polynomial, a coefficient relating to the film thickness of the target substrate as a whole and at least one coefficient relating to a concentric curve component.
Inventors:
TADOKORO MASAHIDE (JP)
TSURUDA TOYOHISA (JP)
TSURUDA TOYOHISA (JP)
Application Number:
PCT/JP2022/003352
Publication Date:
August 11, 2022
Filing Date:
January 28, 2022
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B05C11/00; B05C11/08; B05C11/10; B05D1/40; B05D3/00; G01B11/06; G03F7/16; G03F7/20; H01L21/027; H01L21/66
Domestic Patent References:
| WO2020092393A1 | 2020-05-07 | |||
| WO2006077849A1 | 2006-07-27 |
Foreign References:
| JP2016147246A | 2016-08-18 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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