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Title:
SOIL SENSOR
Document Type and Number:
WIPO Patent Application WO/2022/168757
Kind Code:
A1
Abstract:
This soil sensor includes a base (110), a first detection unit (120), a second detection unit (130), and a circuit unit (170). In a first signal line (121) of the first detection unit, a wiring pattern projected onto installation surfaces (111, 113) of the base is annular in shape. A first GND line (122) of the first detection unit is arranged so as to have a spacing from the first signal line, and moreover is such that a wiring pattern projected onto the installation surfaces of the base is arranged in a region bounded by the wiring pattern of the first signal line projected onto the installation surfaces. The second detection unit is arranged in a region bounded by the wiring pattern of the first GND line projected onto the installation surfaces of the base.

Inventors:
ARIKI TOMOHIDE (JP)
SHIMAKURA KEI (JP)
Application Number:
PCT/JP2022/003362
Publication Date:
August 11, 2022
Filing Date:
January 28, 2022
Export Citation:
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Assignee:
DENSO CORP (JP)
International Classes:
G01R27/26; G01N22/00; G01N22/04; G01N27/02; G01N27/04; G01N27/22; G01N27/416
Foreign References:
JP2012122909A2012-06-28
JP2011191208A2011-09-29
CN105866177A2016-08-17
JP2019184472A2019-10-24
CN102890104A2013-01-23
US6484652B12002-11-26
US20050267700A12005-12-01
JP2021502569A2021-01-28
Attorney, Agent or Firm:
KAI-SEI PATENT FIRM (JP)
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