FILTER CIRCUIT AND PLASMA PROCESSING APPARATUS

WIPO Patent Application WO/2023/286636

A1

This filter circuit comprises a first filter part and a second filter part. The first filter part is provided in wiring between a conductive member and a power supply unit provided inside the plasma processing apparatus. The power supply unit supplies the conductive member with control power that is either DC power or power of a third frequency lower than a second frequency. The second filter part is provided in wiring between the first filter part and the power supply unit. The first filter part is connected in series to the wiring between the conductive member and the second filter part and has a first coil that does not have a core material. The second filter part is connected in series to wiring between the first coil and the power supply unit and has a second coil having a core material. A conducting wire of the second coil is disposed, so as to surround the outer surface of a hollow inner cylinder, on one surface of at least one core material that is annularly disposed around the inner cylinder, wherein the one surface is on the opposite side of the core material from the surface near the inner cylinder.

YAMAZAWA YOHEI (JP)
FUJIWARA NAOKI (JP)

PCT/JP2022/026443

January 19, 2023

July 01, 2022

Click for automatic bibliography generation  

TOKYO ELECTRON LTD (JP)

H01L21/3065; C23C16/505; H01L21/31; H03H7/01; H03H7/075; H05H1/46

WO2020060722A1

2020-03-26

JP2014229565A	2014-12-08
JP2014056706A	2014-03-27
JP2002343263A	2002-11-29
JP2019198010A	2019-11-14
JP2019176138A	2019-10-10
JP2008034812A	2008-02-14
JP2018186497A	2018-11-22

SAKAI INTERNATIONAL PATENT OFFICE (JP)

View/Download PDF      PDF Help

Previous Patent: SUBSTRATE CLEANING DEVICE

Next Patent: HEATING DEVICE, HEATING SYSTEM, AND METHOD FOR OPERATING VEIN HEATING DEVICE