Title:
FINGERPRINT SENSOR MODULE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2015/174775
Kind Code:
A1
Abstract:
The present invention relates to a fingerprint sensor module having a thin thickness, high hardness, high quality texture and excellent luster and having a protective layer capable of reducing sensing signal loss and mountable on a portable electronic device; and a manufacturing method therefor. The method for manufacturing a fingerprint sensor module, according to an embodiment of the present invention, comprises the steps of: (a) fixing a fingerprint sensor by a molding unit; (b) preparing a primer layer on the molding unit; (c) preparing a color layer on the primer layer; (d) preparing a UV bulk so as to cover a side surface of the color layer, a side surface of the primer layer, a side surface of the molding unit and an upper surface of the color layer; and (e) lowering the height of the UV bulk so as to form a protective layer.
Inventors:
LEE DOO HWAN (KR)
Application Number:
PCT/KR2015/004882
Publication Date:
November 19, 2015
Filing Date:
May 15, 2015
Export Citation:
Assignee:
CRUCIALTEC CO LTD (KR)
International Classes:
G06K9/00; H04B1/38
Foreign References:
| KR101355499B1 | 2014-01-29 | |||
| KR101346649B1 | 2014-01-10 | |||
| JPH07299995A | 1995-11-14 |
Attorney, Agent or Firm:
HANA IP LAW FIRM (KR)
특허법인 하나 (KR)
특허법인 하나 (KR)
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