Title:
FIRST ELEMENT AND INTERCONNECTING STRUCTURE OF INTEGRATED ADAPTER AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2020/215248
Kind Code:
A1
Abstract:
Provided in some embodiments of the present application are a first element and an interconnecting structure of an integrated adapter and a manufacturing method therefor. A first electrical interface 204 is provided on the surface of the first element 201. The adapter comprises an insulating body 202 and a first electrically-conductive element 209. The insulating body is manufactured directly on the surface of the first element. A first surface of the adapter is attached to the surface of the first element and a first through hole 208 runs between the first surface and a second surface of the adapter. The first electrically-conductive element 209 is provided in the first through hole, and, a first end of the first electrically-conductive element is connected to the first electrical interface. A second end of the first electrically-conductive element is used for being pressure welded and connected to a second electrical interface 205. The present embodiments, while implementing an electrical interconnection of the fist element and a second element, simplify a manufacturing process for the interconnecting structure.
Inventors:
WANG HONGCHAO (CN)
SHEN JIAN (CN)
SHEN JIAN (CN)
Application Number:
PCT/CN2019/084081
Publication Date:
October 29, 2020
Filing Date:
April 24, 2019
Export Citation:
Assignee:
SHENZHEN GOODIX TECH CO LTD (CN)
International Classes:
H01L21/768; H01L23/48
Foreign References:
| US20100221873A1 | 2010-09-02 | |||
| US20130174417A1 | 2013-07-11 | |||
| CN105140211A | 2015-12-09 |
Attorney, Agent or Firm:
SHANGHAI CHENHAO INTELLECTUAL PROPERTY LAW FIRM GENERAL PARTNERSHIP (CN)
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