Title:
FLEXIBLE CIRCUIT BOARD HAVING ENHANCED BENDING DURABILITY
Document Type and Number:
WIPO Patent Application WO/2017/052046
Kind Code:
A1
Abstract:
The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.
Inventors:
KIM SANG PIL (KR)
LEE DA YEON (KR)
KOO HWANG SUB (KR)
KIM HYUN JE (KR)
JUNG HEE SEOK (KR)
LEE DA YEON (KR)
KOO HWANG SUB (KR)
KIM HYUN JE (KR)
JUNG HEE SEOK (KR)
Application Number:
PCT/KR2016/007477
Publication Date:
March 30, 2017
Filing Date:
July 11, 2016
Export Citation:
Assignee:
GIGALANE CO LTD (KR)
International Classes:
H05K1/02; H05K3/42; H05K3/46
Domestic Patent References:
| WO1996038026A1 | 1996-11-28 |
Foreign References:
| US5262594A | 1993-11-16 | |||
| US5499444A | 1996-03-19 | |||
| US5024896A | 1991-06-18 | |||
| JP2002093526A | 2002-03-29 |
Attorney, Agent or Firm:
ERUUM & LEEON INTELLECTUAL PROPERTY LAW FIRM (KR)
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