Title:
FLEXIBLE CONDUCTOR-CLAD LAMINATE, FLEXIBLE PRINTED WIRING BOARD FOR COF, AND METHODS FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2010/041510
Kind Code:
A1
Abstract:
A flexible conductor-clad laminate sequentially comprising, on one side of a conductor layer (11), a first heat-resistant resin layer (12) which has a thickness of 1-10 μm and is composed of a heat-resistant resin having a glass transition temperature of not less than 320˚C, a thermosetting resin layer (13) which has a thickness of 4-10 μm and is composed of a thermosetting resin composition, and a second heat-resistant resin layer (14) which has a thickness of 10-35 μm and is composed of a heat-resistant resin having a glass transition temperature of not less than 300˚C.
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Inventors:
SATO TETSURO (JP)
Application Number:
PCT/JP2009/063816
Publication Date:
April 15, 2010
Filing Date:
August 04, 2009
Export Citation:
Assignee:
MITSUI MINING & SMELTING CO (JP)
SATO TETSURO (JP)
SATO TETSURO (JP)
International Classes:
H01L23/14; B32B15/08; B32B27/08; H01L21/60; H05K1/03
Foreign References:
| JP2006013135A | 2006-01-12 | |||
| JP2007115722A | 2007-05-10 |
Attorney, Agent or Firm:
KURIHARA Hiroyuki et al. (JP)
Hiroyuki Kurihara (JP)
Hiroyuki Kurihara (JP)
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