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Title:
FLEXIBLE MULTILAYER SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENTS
Document Type and Number:
WIPO Patent Application WO/2012/140964
Kind Code:
A1
Abstract:
A flexible multilayer substrate with built-in electronic components having an excellent capacity for dissipating heat generated by the built-in electronic components is provided. This flexible multilayer substrate with built-in electronic components (100) has electronic components (2) that are built into a flexible multilayer substrate (1), which is provided with a plurality of laminated resin films (3), via conductors (4) formed in prescribed locations in the resin films (3), and wiring conductors (5) formed between prescribed layers of the resin films (3), wherein the built-in electronic components (2) are each configured in such a manner that at least part of the surface thereof is exposed from the flexible multilayer substrate (1).

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Inventors:
OTSUBO YOSHIHITO (JP)
Application Number:
PCT/JP2012/054932
Publication Date:
October 18, 2012
Filing Date:
February 28, 2012
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
OTSUBO YOSHIHITO (JP)
International Classes:
H05K3/46
Foreign References:
JP2006073984A2006-03-16
JPS61210696A1986-09-18
JPH01175296A1989-07-11
JP2007273654A2007-10-18
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