Title:
FLEXIBLE PRINTED CIRCUIT BOARD, WIRING MODULE, FLEXIBLE PRINTED CIRCUIT BOARD WITH TERMINAL, AND ENERGY STORAGE MODULE
Document Type and Number:
WIPO Patent Application WO/2021/084913
Kind Code:
A1
Abstract:
A flexible printed circuit board according to the present invention comprises a conduction path and a land linked to the conduction path, and a terminal can be soldered to the land. The land is provided with a plurality of soldering sections which has a metal surface and to which the terminal is soldered. A partition section having a nonmetal surface is provided between the plurality of soldering sections and divides the adjacent soldering sections.
Inventors:
TAKAHASHI HIDEO (JP)
TAKASE SHINICHI (JP)
SHIMODA HIROKI (JP)
KITAJIMA TSUTOMU (JP)
ADACHI YOSHIRO (JP)
OOHASHI YUUKI (JP)
SUDOU MANABU (JP)
TAKASE SHINICHI (JP)
SHIMODA HIROKI (JP)
KITAJIMA TSUTOMU (JP)
ADACHI YOSHIRO (JP)
OOHASHI YUUKI (JP)
SUDOU MANABU (JP)
Application Number:
PCT/JP2020/033709
Publication Date:
May 06, 2021
Filing Date:
September 07, 2020
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
International Classes:
H01M50/50; H05K3/34
Foreign References:
| JP2018060612A | 2018-04-12 | |||
| JPH06244541A | 1994-09-02 | |||
| JP2010267903A | 2010-11-25 | |||
| JP2013131528A | 2013-07-04 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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