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Title:
FLEXIBLE PRINTED WIRING BOARD AND BATTERY WIRING MODULE
Document Type and Number:
WIPO Patent Application WO/2021/006324
Kind Code:
A1
Abstract:
A flexible printed wiring board according to one aspect of the present disclosure is provided with: a base film having the insulation property; a conductive pattern which is laminated on one surface side of the base film and includes one or a plurality of lands; and a solder resist layer which is laminated on a part or the entirety of an area excluding the lands in one surface of the base film, wherein the CTI value of the solder resist layer is equal to or greater than 200 V.

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Inventors:
UCHITA YOSHIFUMI (JP)
TAKASE SHINICHI (JP)
Application Number:
PCT/JP2020/026937
Publication Date:
January 14, 2021
Filing Date:
July 09, 2020
Export Citation:
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Assignee:
SUMITOMO ELECTRIC PRINTED CIRCUITS INC (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
AUTONETWORKS TECHNOLOGIES LTD (JP)
International Classes:
H05K3/28
Domestic Patent References:
WO2015136720A12015-09-17
Foreign References:
JP2009189459A2009-08-27
JP2002190626A2002-07-05
JP2003172928A2003-06-20
JP2019091789A2019-06-13
JP2007335539A2007-12-27
CN207558994U2018-06-29
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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