Title:
METHOD FOR FORMING SOLDER MASK LAYER ON CIRCUIT BOARD, CIRCUIT BOARD MANUFACTURING METHOD, AND CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/062170
Kind Code:
A1
Abstract:
A method for forming a solder mask layer on a circuit board, a circuit board manufacturing method, and a circuit board. The method for forming a solder mask layer on a circuit board comprises: forming a solder mask film on a circuit board (S11), the solder mask film comprising an ink layer (62) and a first protective layer (61) provided on the ink layer (62), wherein the ink layer (62) is in contact with the surface of one side of the circuit board, and the ink layer (62) is made of an epoxy resin; processing the first protective layer (61) to expose an opening region of the ink layer (62) (S12); etching ink in the opening region to manufacture a solder mask opening (S13); and when the solder mask opening is manufactured, curing the ink layer (62) and removing the first protective layer (61) to form a solder mask layer (S14). The solder mask layer formed by the method has strong rigidity and is suitable for ultra-thin substrates.
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Inventors:
WU PENG (CN)
LI XIAOXIN (CN)
XIONG JIA (CN)
WEI WEI (CN)
LI XIAOXIN (CN)
XIONG JIA (CN)
WEI WEI (CN)
Application Number:
PCT/CN2020/132937
Publication Date:
March 31, 2022
Filing Date:
November 30, 2020
Export Citation:
Assignee:
SHENNAN CIRCUITS CO LTD (CN)
International Classes:
H05K3/28
Foreign References:
| US6395625B1 | 2002-05-28 | |||
| CN103118496A | 2013-05-22 | |||
| CN211019413U | 2020-07-14 | |||
| CN103788342A | 2014-05-14 | |||
| CN210959013U | 2020-07-07 |
Attorney, Agent or Firm:
CHINA WISPRO INTELLECTUAL PROPERTY LLP. (CN)
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